JPS6150379B2 - - Google Patents

Info

Publication number
JPS6150379B2
JPS6150379B2 JP6545979A JP6545979A JPS6150379B2 JP S6150379 B2 JPS6150379 B2 JP S6150379B2 JP 6545979 A JP6545979 A JP 6545979A JP 6545979 A JP6545979 A JP 6545979A JP S6150379 B2 JPS6150379 B2 JP S6150379B2
Authority
JP
Japan
Prior art keywords
resin
punch
burr
lead
resin burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6545979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55157235A (en
Inventor
Kojiro Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6545979A priority Critical patent/JPS55157235A/ja
Publication of JPS55157235A publication Critical patent/JPS55157235A/ja
Publication of JPS6150379B2 publication Critical patent/JPS6150379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6545979A 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit Granted JPS55157235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6545979A JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6545979A JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
JPS55157235A JPS55157235A (en) 1980-12-06
JPS6150379B2 true JPS6150379B2 (en]) 1986-11-04

Family

ID=13287730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6545979A Granted JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS55157235A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230152A (ja) * 1988-07-19 1990-01-31 Nec Corp 半導体装置の製造方法
JP2589184B2 (ja) * 1989-08-10 1997-03-12 三洋電機株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS55157235A (en) 1980-12-06

Similar Documents

Publication Publication Date Title
JPS6150379B2 (en])
US4592131A (en) Method for manufacturing resin-sealed semiconductor device
KR100323189B1 (ko) 반도체장치의제조방법,프레스금형및가이드레일
JPS60261163A (ja) リードフレームの製造方法
WO2018088080A1 (ja) 半導体装置およびその製造方法
JP2580740B2 (ja) リードフレーム
JPH0545063B2 (en])
JPS60161646A (ja) 半導体装置用リ−ドフレ−ム
JPH05144988A (ja) 半導体装置の製造方法並びに半導体製造装置及びリードフレーム
JP2532490B2 (ja) 樹脂封止形半導体装置の製造方法
JP2866816B2 (ja) リードフレーム
JP3077505B2 (ja) リードフレームの製造方法
JPS6084850A (ja) リ−ドフレ−ム
JPS6123352A (ja) リ−ドフレ−ムおよび半導体装置
JPH04324970A (ja) 半導体装置のリードフレームの製造方法
JPH0515065B2 (en])
JP2826508B2 (ja) 半導体装置の製造装置
JPS63308358A (ja) リ−ドフレ−ム
KR200168394Y1 (ko) 반도체 패키지의 리드 프레임
JP2635851B2 (ja) 電子部品の製造に使用するリードフレームの構造
JPH06151681A (ja) 半導体装置の製造方法およびその製造において用いるリードフレーム
JP2538718B2 (ja) 半導体装置の製造方法
JPS6331128A (ja) 樹脂かす除去方法
JPS63257256A (ja) リ−ドフレ−ム
JPH0493057A (ja) 電子部品用リードフレーム及びこれを用いた電子部品の製造方法